Seifert heat conducting and insulating products, so-called TIM materials (Thermal Interface Materials), act as a thermal link between the heat sink and the component to be cooled.
The thermal interface products achieve an optimal thermal connection by avoiding air inclusions. They completely fill the remaining gap between the heat sink and the semiconductor with material with good thermal conductivity.
Insulation products additionally ensure the electrically insulating mounting of the semiconductors on the heat sinks.
Ensure the heat transfer with Seifert heat conducting and insulating products…