Finger heatsinks and U-heatsinks are offered in many high performance variants made of EN AW-1050 (Al 99.5) strip material and of extruded material EN AW-6060 T66 (AlMgSi0.5 F22) for cooling semiconductors.
Ready for mounting with hole pattern, these coolers have a high heat dissipation due to their thermally optimal shape.
Due to the variable finger height the adaptation to the desired power level is possible. The surface of many versions is black anodized as standard, which further increases the thermal performance.
Some coolers are offered with a tin-plated surface to guarantee a good soldering of the heat sinks.