The large range of extruded profile heatsinks made of EN AW-6060 T66 (AlMgSi0.5 F22) with pressed-in solder pins, together with the numerous mounting clips, offers solutions for many types of semiconductor packages.
The star-shaped fin arrangement of many series guarantees maximum thermal performance of the heatsinks in the smallest possible volume.
The solder pins made of tinned brass are designed as beveled sleeves and allow good mounting and soldering.
In the “i” version, insulating rings are additionally fitted with the mounting pins to install the heat sink at a distance from the PCB.
The surface of the heat sinks with solder pins is black anodized, which increases the thermal performance compared to surfaces in bare aluminium.