As part of Power of Electronics in Würzburg, we exhibited our power cooler at the Cooling Days table-top conference.

Seifert’s skiving heat sinks and ThermoFlex series coolers attracted a great deal of interest.
The advantages of Seifert’s new ThermSpread heat spreaders were presented in a practical demonstration.

The conference provided a good overview of the state of the art and the latest trends in component cooling. The combination of a conference covering the basics of thermal management and practical application examples with a table-top exhibition is always a successful concept for providing comprehensive information about the world of thermal management.

In addition, the first prototypes of the CupraMold liquid heat sinks made of copper using the metal powder injection molding process were presented. More on this later.

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